![An old school flatpak IC. [4032x3024 - 2.59MB]](https://pic8.co/sh/d2ymSE.jpg){kind=link}
Oh, you're talking about the device pictured in your post. Yes, I could believe that, and assume the picture is from circa mid-late 1970s? Maybe a GaAs chip? Fastest thing on silicon back in the day.
I wish I had pictures from back in the day to share. The GateArray packaging for the Patriot Missile System was about the peak of packaging for long lead devices. There were 68 leads IIRC, 4 sided, 17 per side (multiple pwr & gnd).
Early 70s by the other material in the drawer.
The exposed die in that device looks ancient. If it was from the early/mid 70s, that die probably came from a 3" or 4" wafer! Not even sub-micron. Lol! They make 300mm wafers now (18" diameter) with geometries in the nanometers. Lots of blood, sweat and tears expended to advance the technology over the years. It was a fun ride but I'm glad I got off in 2004. That high tech shit can totally consume your life for years on end if you let it ... and there is always an array of new barriers to break after breaking through that last one ... a never ending challenge.
Yeah the tech changes so quickly. I suspect the lab at OSU was probably on the bleeding edge here.
(post is archived)