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[–] • 3 pts

Hand setting the packaged ICs in these carriers. The die bonding, stitching and hermetic sealing (glass, IIRC) were all automated processes.

Example Carrier - https://www.sensata.com/products/semiconductor-interconnect/1-14-x-1-14-one-piece-flatpacks

[–] • 3 pts

These were never meant for production, and they came from a university lab. So most of the work was probably done by hand.

[–] • 1 pt

Oh, you're talking about the device pictured in your post. Yes, I could believe that, and assume the picture is from circa mid-late 1970s? Maybe a GaAs chip? Fastest thing on silicon back in the day.

I wish I had pictures from back in the day to share. The GateArray packaging for the Patriot Missile System was about the peak of packaging for long lead devices. There were 68 leads IIRC, 4 sided, 17 per side (multiple pwr & gnd).

[–] • 2 pts

Early 70s by the other material in the drawer.