Or sputter deposition. Etch is usually chemical removal of metallic oxides created by the ebeam or light exposure. The ebeam or light precedes the etching of oxides from the wafer. A uniform layer is deposited (sputter deposition) on the wafer (this process uses ion or atom beam bombardment). Then the wafer is exposed (through a reticule) to ebeam (or light) creating oxides on the areas of the wafer exposed to the light, then removal of those oxides with the chemical etch (like HF), wash (deionized ultra pure water), next layer .... repeat deposit, etch, wash ... repeat 20-40 times to stack layer upon layer depending upon which flavor of semiconductor you are fabricating. That's an oversimplified explanation but good enough.