![An old school flatpak IC. [4032x3024 - 2.59MB]](https://pic8.co/sh/d2ymSE.jpg){kind=link}
Yeah the tech changes so quickly. I suspect the lab at OSU was probably on the bleeding edge here.
OSU probably had some of the best equipment available in the day. I'm not familiar with any wafer fabs in that vicinity back then. My facility was built in 1964 (Fairchild) and could very well have made that die.
In the 1970s through early 1990s we manufactured classified devices for DARPA/Maryland. We fabbed and shipped wafers, ET only, no sort, packaging or final test. We didn't even know what the device functions were. Very secret stuff at the time.
I wish I had some idea of what they were doing here. Everyone is long since dead.
Guaranteed it was very cool shit at the time! ATE test solutions were stored on mag tape, transferred to paper tape, read by the ATE. The guy writing the test solution for that device probably used an IBM mainframe, MAG tape storage, card puncher, card readers, shoe boxes full of cards or drawers of MAG tapes to store programs, fixtures, devices ... multiple revisions ...
The test system likely had a wire wrap memory core programmed in machine language. Https://www.vintagecomputer.net/core-memory/
Lots of technical hurdles overcome to get to where we are today. The young have no clue.
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