That's really cool, except for the part where the laser destroys the dies on the IC and MOSFETs. It would be nice if the fiber laser didn't affect the die substrate while removing the epoxy encasement since that would be a great tool for Ken Sheriff to use to get his detailed chip photographs and breakdown of the structural components of the circuit.
http://www.righto.com/2022/01/silicon-die-teardown-look-inside-early.html
That's really cool, except for the part where the laser destroys the dies on the IC and MOSFETs. It would be nice if the fiber laser didn't affect the die substrate while removing the epoxy encasement since that would be a great tool for Ken Sheriff to use to get his detailed chip photographs and breakdown of the structural components of the circuit.
http://www.righto.com/2022/01/silicon-die-teardown-look-inside-early.html
I wonder whether lowering the power once near the die would preserve it.
I wonder whether lowering the power once near the die would preserve it.
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