Archive: https://archive.today/Vp9s7 From the post: >>The kilowatt era of CPUs is upon us, as AMD is preparing specialized cooling for its next-generation SP7 socket powering EPYC "Venice". During the OCP APAC 2025 Summit in early August, Microloops held a presentation dedicated entirely to system-level cooling using custom high-performance cold plates, cooling distribution units, and much more. However, an interesting tidbit is the mention of AMD and its plan to likely cool CPUs with TDPs ranging from 700 to 1400 W. This marks AMD's first step into a kilowatt-level chip design, requiring kilowatt-level cooling. AMD is preparing to roll out its Zen 6 microarchitecture in 2026, with a server-focused flagship called EPYC "Venice." The new platform is expected to significantly increase core counts, utilizing full-sized Zen 6 cores and an updated I/O subsystem to target much stronger multithreaded throughput. AMD is reportedly configuring Venice to support as many as 256 CPU cores in a single package, a big leap intended to sharpen its position in dense compute environments.