Archive: https://archive.today/fh1GZ From the post: >>The global computing industry's pursuit of AI breakthroughs is hitting a "thermal wall." That phrase comes directly from a team at the Chinese Academy of Sciences, and they are not being dramatic. Every watt pushed through a GPU die has to go somewhere. The path from silicon to heat sink is governed by a thin layer of thermal interface material, and that layer is now the bottleneck holding back the entire AI hardware stack. A functional carbon materials team at the Ningbo Institute of Industrial Technology, part of CAS, has responded with a diamond-copper composite coating that improved cooling efficiency by 80% when deployed at an AI computing node in Zhengzhou, Henan province. The composite also delivered a 10% improvement in chip performance. Numbers like that demand both scrutiny and a serious look at what this team actually built.